Altium

Design Rule Verification Report

Date: 4/27/2018
Time: 8:44:15 AM
Elapsed Time: 00:00:10
Filename: D:\ALTIUM_WORK\00001_MCHP-CDB\Boards\16-07349\PCB Files\Rev5\Project Files\SAM L11\04-07349-R5_L11.PcbDoc
Warnings: 0
Rule Violations: 5

Summary

Warnings Count
Total 0

Rule Violations Count
Clearance Constraint (Gap=0.15mm) (All),(All) 0
Clearance Constraint (Gap=0.6mm) (IsRegion or InPoly),(InNet('PA02_ADC0') or InNet('PA03_ADC1_VREF') or InNet('NetCS300_1') or InNet('PB06_QTBTN1_SLCDX1') or InNet('PA20_GPIO_S2_4_RTS') or InNet('PA21_GPIO_S2_3_CTS') or InNet('PB08_PWM_TC0_0') or InNet('PB09_PWM_TC0_1') or InNet('PC02_GPIO_IRQ10') or InNet('PC03_GPIO_SS') or InNet('PA23_S2_1_UART_RX') or InNet('PA22_S2_0_UART_TX') or InNet('PB04_GPIO_SLCDY2') or InNet('PB05_GPIO_SLCDY1') or InNet('PA27_PWM_TCC0_5_SLCDY0')) 0
Clearance Constraint (Gap=0.119mm) (Touchesroom('EDBG_ROOM_1')or InComponent('U200')),(All) 0
Clearance Constraint (Gap=0.175mm) (InPoly),(All) 0
Clearance Constraint (Gap=0.6mm) (IsRegion),(InDifferentialPairClass('All Differential Pairs')) 0
Short-Circuit Constraint (Allowed=No) (All),(All) 0
Un-Routed Net Constraint ( (All) ) 0
Width Constraint (Min=0.125mm) (Max=1mm) (Preferred=0.15mm) (TouchesRoom('EDBG_ROOM_1')) 0
Width Constraint (Min=0.15mm) (Max=1mm) (Preferred=0.15mm) (All) 0
Routing Via (MinHoleWidth=0.25mm) (MaxHoleWidth=0.5mm) (PreferredHoleWidth=0.25mm) (MinWidth=0.55mm) (MaxWidth=1mm) (PreferedWidth=0.55mm) (All) 0
Routing Via (MinHoleWidth=0.2mm) (MaxHoleWidth=0.5mm) (PreferredHoleWidth=0.25mm) (MinWidth=0.4mm) (MaxWidth=1mm) (PreferedWidth=0.55mm) (TouchesRoom('EDBG_Room_1') Or InComponent('U200')) 0
Routing Via (MinHoleWidth=0.2mm) (MaxHoleWidth=0.5mm) (PreferredHoleWidth=0.25mm) (MinWidth=0.4mm) (MaxWidth=1mm) (PreferedWidth=0.55mm) (InDifferentialPairClass('All Differential Pairs')) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=0.2mm) (Max=0.22mm) (Prefered=0.2mm) and Width Constraints (Min=0.18mm) (Max=0.18mm) (Prefered=0.18mm) (InDifferentialPair('EDBG_USB_HS') or InDifferentialPair('TARGET_USB')) 0
Differential Pairs Uncoupled Length using the Gap Constraints (Min=0.2mm) (Max=1.5mm) (Prefered=0.2mm) and Width Constraints (Min=0.12mm) (Max=0.18mm) (Prefered=0.18mm) (InDifferentialPair('EDBG_USB_FS')) 0
SMD Neck-Down Constraint (Percent=90%) (All) 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.2mm) (Conductor Width=0.2mm) (Air Gap=0.2mm) (Entries=4) (HasFootprint('AP8-00257')) 0
Power Plane Connect Rule(Direct Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (IsVia OR HasPad('Free-666')) 0
Power Plane Connect Rule(Relief Connect )(Expansion=0.508mm) (Conductor Width=0.254mm) (Air Gap=0.254mm) (Entries=4) (All) 0
Assembly Testpoint Style (Under Component=Yes) (HasFootprint('AP8-00010') or HasFootprint('AP9-00044') or InNet('NetC407_1') or InNet('NetR105_2')) 0
Assembly Testpoint Style (Under Component=Yes) (All) 3
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('PA14')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('USB_P')) 0
Assembly Testpoint Usage (Valid =One Required, Allow multiple per net=No) (Disabled)(All) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('XOUT0')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('XOUT32')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('NetCS700_1')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('USB_N')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('EDBG_USB_FS_N')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('PA15')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('XIN0')) 0
Assembly Testpoint Usage (Valid =Invalid, Allow multiple per net=No) (InNet('XIN32')) 0
Minimum Annular Ring (Minimum=0.1mm) (All) 0
Acute Angle Constraint (Minimum=70.000) (All) 0
Hole Size Constraint (Min=0.15mm) (Max=10mm) (All) 0
Pads and Vias to follow the Drill pairs settings 0
Hole To Hole Clearance (Gap=0.3mm) (All),(All) 0
Minimum Solder Mask Sliver (Gap=0.075mm) (All),(All) 0
Silk To Solder Mask (Clearance=0.075mm) (IsPad),(All) 0
Silk to Silk (Clearance=0mm) (IsText),(IsText) 0
Silk to Silk (Clearance=0.1mm) (All),(All) 0
Net Antennae (Tolerance=4mm) (Not Testpoint) 1
Room EDBG_ROOM_1 (Bounding Region = (195.445mm, 178.1mm, 202.655mm, 185.305mm) (All) 1
Component Clearance Constraint ( Horizontal Gap = 0mm, Vertical Gap = 0mm ) (InComponent('J206') or IsFree),(IsFree) 0
Component Clearance Constraint ( Horizontal Gap = 0.1mm, Vertical Gap = 0.1mm ) (All),(All) 0
Component Clearance Constraint ( Horizontal Gap = 0mm, Vertical Gap = 0mm ) (All),(InComponent('J900') or InComponent('J901') or InComponent('J902') or InComponent('J903') or InComponent('J904')) 0
Total 5

Assembly Testpoint Style (Under Component=Yes) (All)
Assembly Testpoint Style: Pad Free-3(-48.125mm,-15.425mm) on Bottom Layer LF-signals - Bottom Side testpoint violates min clearance to component Q501 body
Assembly Testpoint Style: Pad Free-3(-52.625mm,-21.745mm) on Bottom Layer LF-signals - Bottom Side testpoint violates min clearance to component Q500 body
Assembly Testpoint Style: Pad Free-3(-46.85mm,-15.4mm) on Bottom Layer LF-signals - Bottom Side testpoint violates min clearance to component Q501 body

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Net Antennae (Tolerance=4mm) (Not Testpoint)
Net Antennae: Via (-45.813mm,-90.283mm) from Top Layer LF-signals to Bottom Layer LF-signals

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Room EDBG_ROOM_1 (Bounding Region = (195.445mm, 178.1mm, 202.655mm, 185.305mm) (All)
Room Definition: Between BGA Component U200-100 ball VFBGA (-25.025mm,-20.775mm) on Bottom Layer LF-signals And Room EDBG_ROOM_1 (Bounding Region = (195.445mm, 178.1mm, 202.655mm, 185.305mm) (All)

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